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der IMAPS 2015

Das 48. internationale Symposium zu Mikroelektronik, organisiert von der IMAPS,  findet in der Zeit vom 27.-29. Oktober in Orlando statt.

Am 28. Oktober wird Herr Yangyang Long seine Arbeit mit dem Titel: "Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding Process" in der Session über "Advanced Packaging & Enabling Technologies" vorstellen.

Inhalt der vorgestellten Arbeit

In this work, the motion behavior at the wire/substrate interface and the wire/tool interface was observed. For the first time, the relative motion at the wire/substrate interface was captured at a frame rate (max. 350,515fps) that is higher than the bonding frequency. The existence of relative motion between the wire and the tool was verified for the first time via the high speed video observation. These findings will help a better understanding of the bonding process.