Konferenz (reviewed)

  • Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel J., Wurz, M. (2020): Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire BondingElectronic Components and Technology Conference (ECTC), Jun. 3-30, Orlando, USA, pp.276-283
    DOI: 10.1109/ECTC32862.2020.00053
  • Schneider, F., Long, Y., Ohrdes, H., Twiefel, J., Brökelmann, M., Hunstig, M., Venkatesh, A., Hermsdorf, J., Kaierle, S., Overmeyer, L. (2019): Effect of laser assistance in ultrasonic copper wire bondingLasers in Manufacturing
  • Long, Y., He, B., Cui, W., Zhuang, X., Twiefel, J. (2018): Molecular dynamics simulation of microwelds formation and breakage during ultrasonic copper wire bondingIEEE 68th Electronic Components and Technology Conference
    DOI: 10.1109/ECTC.2018.00219
  • Long, Y.; Dencker, F.; Isaak, A.; Li, C.; Schneider, F.; Hermsdor, J.; Wurz, M.; Twiefel, J.; Wallaschek, J. (2017): Analysis of the Wire/Substrate Interface during Ultrasonic Bonding ProcessIEEE CPMT Symposium Japan (ICSJ), Nov 20-22, 2017 Kyoto, Japan, S. 203-206
  • Long, Y.; Dencker, F.; Isaak, A.; Schneider, F.; Hermsdor, J.; Wurz, M.; Twiefel, J. (2017): Visualization of Oxide Removal during Ultrasonic Wire Bonding Process19th IEEE Electronics Packaging Technology Conference (EPTC), Dec 6-9, 2017 Singapore, S. 1-4
  • Long, Y.; Dencker, F.; Schneider, F.; Emde, B.; Li, C.; Hermsdorf, J.; Wurz, M.; Twiefel, J. (2016): Investigations on the Oxide Removal Mechanism during Ultrasonic Wedge-Wedge Bonding ProcessIEEE 18th Electronics Packaging Technology Conference, November 30 - December 3, Singapore, Southeast Asia, pp. 405-410
  • Long, Y.; Dencker, F.; Wurz, M.; Feldhoff, A.; Twiefel, J. (2016): A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding processInternational Symposium on Microelectronics, October 10-13, Pasadena, USA, pp. 427-432
  • Long, Y.; Twiefel, J.; Roth, J.; Wallaschek, J. (2015): Real-time observation of interface relative motion during ultrasonic wedge-wedge bonding processIn International Symposium on Microelectronics, IMAPS (International Microelectronics, Assembly and Packaging Society), pp. 419-424

Zeitschrift (reviewed)

  • Lian, Y., Long, Y., Zhao, G., Mu, C., Li, X., Deng, J., Xie, C. (2020): Performance of CrCN-WS2 hard/soft composite coated tools in dry cutting of titanium alloysJournal of Manufacturing Processes, 54, pp.201-209
    DOI: https://doi.org/10.1016/j.jmapro.2020.03.014
  • Long, Y., He, B., Cui, W., Ji, Y., Zhuang, X., Twiefel, J. (2020): Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulationMaterials & Design, 192, 108718
    DOI: https://doi.org/10.1016/j.matdes.2020.108718
  • You, C., Zhao, G., Chu, X., Zhou, W., Long, Y., Lian Y. (2020): Design, preparation and cutting performance of bionic cutting tools based on head microstructures of dung beetleJournal of Manufacturing Processes, 58, pp.129-135
    DOI: https://doi.org/10.1016/j.jmapro.2020.07.057
  • Zhang, T., Long, Y., Mu, C., Zhou, W., Zhao, G., Lian Y. (2020): Performance of soft/hard composite dual-effect coated tool in dry cutting of carbon fiber–reinforced polymerThe International Journal of Advanced Manufacturing Technology, 109, pp.2221-2232
    DOI: https://doi.org/10.1007/s00170-020-05778-w
  • Bai, F., Long, Y., Saalbach, K.A., Twiefel, J. (2019): Theoretical and experimental investigations of ultrasonic sound fields in thin bubbly liquid layers for ultrasonic cavitation peeningUltrasonics, 93, pp.130-138
    DOI: https://doi.org/10.1016/j.ultras.2018.11.010
  • Li, Y., Cheng, Z., Chen, X., Long, Y., Li, X., Li, F., Li, J., Twiefel, J. (2019): Constitutive modeling and deformation analysis for the ultrasonic-assisted incremental forming processThe International Journal of Advanced Manufacturing Technology 104, pp.2287–2299
    DOI: https://doi.org/10.1007/s00170-019-04031-3
  • Long, Y., Bai, F., Zhang, Y., Saalbach, K.A., Twiefel, J. (2019): Impacts of ultrasound on oxide removal–An attempt towards acid-free cleaningUltrasonics sonochemistry, 57, pp.1-11
    DOI: https://doi.org/10.1016/j.ultsonch.2019.05.003
  • Long, Y., Schneider, F., Li, C., Hermsdorf, J., Twiefel, J., Wallaschek, J. (2019): Quantification of the energy flows during ultrasonic wire bonding under different process parametersInternational Journal of Precision Engineering and Manufacturing-Green Technology, 6(3), pp.449-463
    DOI: https://doi.org/10.1007/s40684-019-00061-0
  • Long, Y., Twiefel, J., Wallaschek, J. (2019): Contact mechanics and friction processes in ultrasonic wire bonding-Basic theories and experimental investigationsJournal of Sound and Vibration, p.115021
    DOI: https://doi.org/10.1016/j.jsv.2019.115021
  • Bai, F., Saalbach, K.-A., Long Y., Twiefel, J., Wallaschek, J. (2018): Capability evaluation of ultrasonic cavitation peening at different standoff distances.Ultrasonics
    DOI: /10.1016/j.ultras.2017.10.013
  • Long Y., Li Y., Sun J., Ille I., Li J., Twiefel J. (2018): Effects of process parameters on force reduction and temperature variation during ultrasonic assisted incremental sheet forming process, The International Journal of Advanced Manufacturing Technology, pp. 1-12
    DOI: https://doi.org/10.1007/s00170-018-1886-0
  • Long, Y., Dencker, F., Isaak, A., Hermsdorf, J., Wurz, M., Twiefel, J. (2018): Self-Cleaning Mechanisms in Ultrasonic Bonding of Al Wire, Journal of Materials Processing Technology 258, pp. 58-66
    DOI: https://doi.org/10.1016/j.jmatprotec.2018.03.016
  • Long, Y., Dencker, F., Isaak, A., Li, C., Schneider, F., Hermsdorf, J., Wurz, M., Twiefel, J., Wallaschek, J. (2018): Revealing of ultrasonic wire bonding mechanisms via metal-glass bondingMaterials Science and Engineering: B
    DOI: https://doi.org/10.1016/j.mseb.2018.11.010
  • Wang, L., Sun, W., Long, Y., Yang, X. (2018): Reliability-Based Performance Optimization of Tunnel Boring Machine Considering Geological Uncertainties, IEEE Access 6, pp. 19086 - 19098
    DOI: 10.1109/ACCESS.2018.2821190
  • Long, Y.; Twiefel, J. and Wallaschek, J. (2017): A review on the mechanisms of ultrasonic wedge-wedge bondingJournal of Materials Processing Technology, 245, 2017, pp. 241-258