Conferences (reviewed)

• Arndt, M.; Long, Y.; Hu, C.; Dencker, F.; Twiefel, J.; Wurz, M. (2023): Manufactruing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding,  MikroSystemTechnik Kongress 2023, Oktober 23-25, Dresden, Deutschland, 2023